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Xperi  (Stock symbol: XPER )

3025 Orchard Parkway
San Jose, CA 95134
Website Company Summary Management Team

Outside board: (May no longer be on the board) George A. Riedel (Cloudmark Former CEO) Richard S. Hill (Novellus Systems Former CEO) John H. F. Miner (Intel Capital Former President) David Habiger (Silver Lake Partners sr. advisor) Darcy Antonellis (Vubiquity CEO/CTO) V. Sue Molina (Deloitte & Touche Former Partner)
Former outside board: Kevin Rivette (Aurigin Systems Former CEO) Bruce M. McWilliams (Xperi Chairman) David C. Nagel (PalmSource President/CEO) Christopher A. Seams (Cypress Semiconductor) Timothy J. Stultz (Nanometrics President/CEO) Nicholas Brathwaite (Flex Former CTO) Jim Guzy (Arbor Company President);  John Chenault (Novellus Systems Former CFO) Anthony J. Tether (Defense Advanced Research Projects Agency (DARPA) Former Director) Borje Ekholm (Investor AB) Robert Boehlke (KLA Former COO) Patricia Cloherty (Patricof & Co. Ventures);  Torbjorn Folkebrant (Ericsson);  John B. Goodrich (Wilson Sonsini Goodrich & Rosati Former Partner) Al Joseph (Vitesse Semiconductor Founder) Harry Kabetas (Kodak CFO);  Rein Narma (General Instruments Asst Chairman);  Henry Nothhaft (Danger CEO)

Business description: Tessera is the high-tech industry’s premier provider of intellectual property and services that enable the semiconductor industry to develop smaller, faster, and more reliable electronic products. The company holds several hundred patents worldwide covering chip-scale and multi-chip packages (CSPs and MCPs), nearly 2 billion of which have been integrated into leading wireless, communications, computing, and consumer electronic products. Tessera's Intellectual Property portfolio includes hundreds of issued and pending patents. We are developer and licensor of small, high-performance and reliable packaging solutions. In fact, we began the Chip Scale Packaging industry with our µBGA® technology, which has been licensed by over 40 semiconductor manufacturers and assemblers around the world.
Customers include: 3M CompanyAdvanced Micro DevicesDPAC TechnologiesHitachi, Ltd.Hynix SemiconductorIntelMatsushitaMitsuiAndCo.NECSanyoSharpSONYTexas InstrumentsToshiba;  Casio Computer ;  Mitsubishi ElectricAndElectronics USA, Inc.;  North Dakota State University;  Renesas Technology;  Rohm;  Seiko Epson;  Shinko;  Siemens AG;  ST Microelectronics
Partners include: 3M CompanyCompaqDPAC TechnologiesFlexeraIntelMitsuiAndCo.PlexusRead-RiteSiemensTexas InstrumentsToshiba;  Oki Electric Industry;  Rohm;  Shinko;  Unified Test Centers

Rounds: 6
Capital raised: 100.2M
Ownership: Public  
Stock Symbol: XPER
Corporate investors: Rambus;  Shinko;  LG Venture Investment

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Record updated: Dec 2019
Sector: Semiconductor Equipment
Year Founded: 1990
Headcount: 701-800 as of Dec 2019
Rounds: 6
Capital Raised: 100.2M
Ownership: Public  
Stock Symbol: XPER