Amkor Technology, Inc. (Amkor) is subcontractor of semiconductor packaging and test services. The Company has designed and developed a number of package formats and technologies, including its Package-on-Package with Through Mold Via (TMV), FusionQuad, fcBGA (Flip Chip Ball Grid Array), conformal shielding and copper pillar bumping and packaging technologies. It is also engaged in developing integrated circuit packaging, which involves the elimination of lead and certain other materials. Amkor provides a range of test engineering services for radio frequency mixed signal, logic and memory devices, test program development, product characterization. Amkor is a provider of radio frequency test services and strip test, a test solution. The Company's packages are designed for application specific body size and electrical connection requirements. October 30, 2009, Amkor acquired a 30% interest in an assembly and test services business in Japan, J-Devices Corporation.